Electro-photonic silicon design
Silicon for
Intelligence.
High-speed analog/mixed-signal and electro-photonic interconnect: SerDes, transceivers, and silicon-proven IP across advanced CMOS and silicon photonics platforms. We solve the data-movement bottleneck for AI, HPC, data-centers, and Physical AI.
Electronics · SerDes, TIAs, drivers, ADC/DAC, Clocking
Photonics · MRMs, MZIs, PDs, WDM
Markets · AI · HPC · Data Center · Physical AI
The challenge
The Bottleneck at the Heart of AI.
Every breakthrough in artificial intelligence, from larger models to faster inference and new Physical AI systems (machines that sense, decide, and act in the real world), drives exponential demand for data movement. In AI and HPC data centers, most of the energy goes not to computation but to moving data between processors, memory, and the network.
Electrical interconnects, the backbone of these systems, are reaching their fundamental limits. The answer to this limit is photonics, replacing electrical links with optical ones that move data at the speed of light, at a fraction of the energy. But the transition is not a simple swap. It demands a new class of silicon that fuses high-performance electronic circuits with integrated photonic devices on a single platform.
Meeting that bar demands fused electro-photonic silicon, built by teams that have taped out and measured it.
The solution
Bridging electronics and photonics.
StarIC architects the full electro-photonic link across advanced CMOS, silicon photonics, and multi-die integration, from monolithic platforms to 3D-stacked assemblies. An extensive library of IP and a multi-domain team deliver when catalog IP fits; we build from scratch when requirements go further.
Core competency
Analog/Mixed-Signal & SerDes Design.
How customers engage with StarIC, from proven IP blocks to full custom programs.
SerDes & PHY IP
Die-to-die, long-reach, and APX PHY with multi-tap equalization.
Transceiver building blocks
TIAs, MRM/MZI drivers, ADC/DAC.
70+ silicon-proven IPs
Bundle licensing for platform and OEM programs.
Ground-up custom silicon
When off-the-shelf IP doesn't fit, multi-domain AMS purpose built from scratch.
By the numbers
Experienced team. Measured silicon.
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Years of cumulative design experience
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Headcount
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IPs in our design library
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Global design centers
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Technical staff with PhDs
Silicon Validated
StarIC and Inova Semiconductors Validate APXpress Silicon for Physical AI
Initial silicon validation on GF 22FDX®: joint work with Inova on the APXpress PHY for robotics, automotive, and Physical AI.
"Interconnect is a core platform technology for intelligent systems."
Imran Ahmed, CEO, StarIC
How to engage
Start with the path that fits your program.
Whether you need proven interconnect IP, a full electro-photonic platform, or ground-up custom silicon, StarIC brings AMS and photonics expertise to shorten integration and tapeout risk.